This fanless industrial computer offers it all: An industrial design free of moving parts, support for Power-over-Ethernet cameras and USB3 cameras, a CPU that can handle multiple cameras with high frame rates, a PCIe slot for additional cameras or I/O, a wide temperature range, and optional integrated discrete 24VDC I/O. Combined with your choice of several powerful CPUs, this platform is ready for demanding industrial machine vision installations.
NO MOVING PARTS
Why should you choose a computer without moving parts? Because it’s the moving parts that fail first. When a cooling fan stops turning, or the hard-disk drive stops spinning, it is sure to be expensive.
It isn’t hard to build a consumer-grade “gaming” computer. But building a fanless system that can handle industrial environments is another matter altogether. The Neousys design puts the CPU right up against the large external heat sink. It can handle 70 degrees C (or 50 degrees C in 65 watt mode) under full load.
Compare the performance of these 8th and 9th generation CPUs against other fanless embedded computers intended for machine vision. We think you'll discover this computer is able to process images faster, while enabling you to run more powerful analysis algorithms.
You can adjust the BIOS of this computer to operate the CPU at either 35 watts or 65 watts. The lower power setting enables operation in ambient temperatures up to 70 degrees C, as compared to 50 degrees C for the higher power setting. Or choose the 65 watt mode for maximum performance.
This computer has six Gigabit Ethernet ports. Four of those ports can deliver Power-over-Ethernet (as a factory option) so cameras and other devices can be powered without pulling additional cables or purchasing external power supplies. To maximize bandwith, five ports have independent Intel I210 controllers, with the sixth having an I219 controller. All ports support jumbo packets to keep CPU interrupts to a minimum. The I210 controller is supported by the Basler Pylon Performance Driver (version 4.1.0 and newer) to further enhance imaging performance.
This industrial computer offers optional integrated discrete I/O for interfacing with PLCs, light controllers, and other devices. Choose the 16 channel board or the 32 channel board. The 5 - 24 VDC inputs are optically isolated, and can be programmed for polling or change-of-state interrupt. The 24 VDC discrete outputs are also isolated. (Order item CRNS360-IO to have the 32-channel board included, at additional cost.)
DELIVERY, CUSTOMIZATION & ACCESSORIES
In addition to the configuration options listed on this page, alternate options are available for volume customers. Suggested accessories include power supply, DIN rail mount, I/O cable and I/O termination board.
|Processor:||Supporting Intel 9th/ 8th-Gen CPU (LGA1151 socket, 65W/ 35W TDP)|
|Chipset:||Intel® Q370 Platform Controller Hub|
|Graphics:||Integrated Intel® UHD Graphics 630|
|Memory:||Up to 64 GB DDR4 2666/ 2400 SDRAM (two SODIMM slots)|
|AMT:||Supports AMT (Active Management Technology) 12.0|
|TPM:||Support TPM (Trusted Platform Module) 2.0|
|Ethernet:||6 Gigabit Ethernet ports (1x I219 and 5x I210)|
|PoE+||Optional IEEE 802.3at PoE+ PSE for four ports with 100 W total power budget|
|USB:||4x USB 3.1 Gen2 (10 Gbps) ports; 4x USB 3.1 Gen1 (5 Gbps) ports; 1x internal USB port (e.g. for license dongle)|
|Video:||1x VGA connector, supporting 1920 x 1200 resolution; 1x DVI-D connector, supporting 1920 x 1200 resolution; 1x DisplayPort connector, supporting 4096 x 2304 resolution|
|Serial Ports:||2x software-programmable RS-232/422/485 ports (COM1/ COM2); 2x RS-232 ports (COM3/ COM4)|
|Audio:||3.5 mm jack for mic-in and speaker-out|
|PCI Express:||1x PCIe x16 slot@Gen3, 8-lanes PCIe signals in Cassette (PCI variant available)|
|Mini PCI-E:||1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA)|
|M.2:||1x M.2 2242 B key socket with dual front-accessible SIM sockets, supporting dual SIM mode with selected M.2 LTE module|
|Expansion I/O:||1x MezIO™ expansion port for Neousys MezIO™ modules|
|Dimensions:||240 mm (W) x 225 mm (D) x 90 mm (H)|
|Mounting:||Wall-mount bracket included; DIN-rail mount optional|
|Operating Temperature:||0 - 70°C configured as 35W TDP; 0 - 50°C configured as 65W TDP; -25°C optional|
|Storage Temperature:||-40°C - 85°C|
|Humidity:||10% - 90% , non-condensing|
|Vibration:||Operating, MIL-STD-810G, Method 514.6, Category 4|
|Shock:||Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II|
|EMC:||CE/FCC Class A, according to EN 55032 & EN 55024|
Orders for this item cannot be cancelled, nor returned. (Sorry, but this is the manufacturer's policy.)